New Optek Systems’ Lasercleave™ has been introduced to our interconnect process

New Optek Systems’ Lasercleave™ has been introduced to our interconnect process with exceptional results. Technical Manager, Barry Williams commented, “Laser Cleaver technology eliminates the need for mechanical scribing/cleaving and allows for the reduction of a number of polishing steps required for connector finishing with improved consistency and reliability.

As part of our new production process, we have seen time savings of up to 2hrs 40mins man hours per day”. Not only has the equipment increased accuracy and standardisation to our processes, it has benefitted us by reduced lapping film use for both air and machine polishing and subsequent consumable costs.